Parylene Application Process

Parylene application is a true chemical vapor deposition (CVD) sequence. The utilized used in applying parylene consists of three primary components: a Vaporizer, A Pyrolizer, and a Deposition chamber. The dimer, in its original powder form, is loaded in the Vaporizer, and the materials to be coated are loaded downstream in the deposition chamber. The diX parylene dimer is vaporized at approximately 120°C - 180°C, and the gas is drawn into the Pyrolizer, where it is heated to approximately 650°C - 700°C and converted to a monomer. The vacuum pump then draws this gas into the deposition chamber, where it is cooled to ambient temperature. Upon contact with the surface of the item(s) being coated, it polymerizes into Poly-Para-Xylyene polymer film.

Typical equipment types consist of either vertical chamber systems (for PCBs, Sensors, wires, etc.) or Tumble coating devices having horizontal chambers for high volume processes (such as viton o-rings, silicone rubber parts, ferrite cores, etc.).

Parylene can be uniformly applied to any surface with a constant thickness ranging from angstroms to microns or mils. Our expert operators apply the correct amount of dimer and monitor the duration of the coating process to achieve the desired thickness.